• 专利标题:   High thermal conductivity graphene film, prepared by placing three-dimensional graphene thick film in metal ion plating solution, electroplating, plating metal, pressure heating, incubating and naturally cooling.
  • 专利号:   CN112760082-A
  • 发明人:   SUN B, WANG X
  • 专利权人:   YINHEZHIXING CHENGDU NEW ENERGY CO LTD
  • 国际专利分类:   C09K005/14
  • 专利详细信息:   CN112760082-A 07 May 2021 C09K-005/14 202150 Pages: 6 Chinese
  • 申请详细信息:   CN112760082-A CN10203482 23 Feb 2021
  • 优先权号:   CN10203482

▎ 摘  要

NOVELTY - High thermal conductivity graphene film, is claimed. The principle is filling the middle of the graphene sheet using high thermal conductivity material nano-scale flakes (e.g. copper, silver and other metals or silicon carbide non-metallic materials), and tightly combining with the graphene sheet. USE - Used as high thermal conductivity graphene film. ADVANTAGE - The graphene film reduces the air between the graphene sheets, increases the number of graphene sheets per unit thickness of the graphene film, improves the horizontal thermal conductivity, enhances the phonon heat transfer between graphene sheets, and improves the thermal conductivity perpendicular to the direction of the graphene film. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparation method of high thermal conductivity graphene film, comprising (1) placing the three-dimensional graphene thick film in the metal ion plating solution, electroplating, plating metal (copper or silver high thermal conductivity material) on the graphene sheet, and controlling the electroplating time to obtain the required thickness of the electroplated metal layer; (2) taking two sheets of smooth copper foil (or other high thermal conductivity material film) with a certain thickness, and sticking on both sides of the electroplated thick graphene film; and (3) placing the three-dimensional graphene thick film coated with copper foil (or other materials) into a vacuum hot press or plasma sintering machine, pressure heating, incubating for a certain period of time, and naturally cooling; or coating copper on the graphene sheet, heating the copper-plated graphene sheet above the melting point of copper, carrying out hot press molding or plasma pressure sintering, and cooling.