▎ 摘　　要

NOVELTY - High thermal conductivity graphene modified polyimide porous material comprises diamine functionalized graphene, 3,5-diaminobenzoic acid, dianhydride monomer, acetic anhydride and pyridine in a mass ratio of (5-30):100:(150-220):(10-20):(8-12). USE - As a high thermal conductivity graphene modified polyimide porous material. ADVANTAGE - The material has improved dispersibility of graphene and polyimide, and enhanced thermal conductivity and tensile strength. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing the material involving (a) adding graphene oxide, sodium hydroxide and chloroacetic acid with a mass ratio of 1:(2-6):(1.5-4) to a distilled water solvent, ultrasonically reacting at 30-50 degrees C for 2-4 hours, centrifuging, washing and drying to obtain carboxylated graphene, (b) adding carboxylated graphene to distilled water solvent, ultrasonically dispersing, adding polyethylene glycol, 1-ethyl-(3-dimethylaminopropyl) carbodiimide hydrochloride as condensation agent and N-Hydroxysuccinimide as additive in a nitrogen atmosphere, heating at 50-70 degrees C and reacting for 20-30 hours, centrifuging, washing and drying to obtain polyethylene glycol grafted graphene, (c) adding the polyethylene glycol grafted graphene to a mixed solvent of N,N-dimethylformamide and toluene in a volume ratio of (3-8):1, ultrasonically dispersing, adding 3,5-diaminobenzoic acid and p-toluenesulfonic acid as catalyst in a nitrogen atmosphere, heating at 70-90 degrees C, reacting for 1-2 hours, heating at 120-150 degrees C to react for 5-10 hours, cooling, precipitating, filtering, centrifuging, washing and drying to obtain diamine functionalized graphene, (d) adding the diamine-functionalized graphene to N,N-dimethylformamide, ultrasonically dispersing, adding 3,5-diaminobenzoic acid and dianhydride monomers, carrying out chemical imidization in a nitrogen atmosphere for 10-15 hours, adding acetic anhydride as dehydrating agent and pyridine catalyst, reacting for 15-25 hours, adding the solution into the film forming mold, placing in an oven and heating at 100-120 degrees C for 1-1.5 hours, heating at 200-220 degrees C for 1-1.5 hours, heating again at 280-320 degrees C for 1-2 hours, cooling to 150-180 degrees C and heat treating for 4-8 hours to obtain he product.