▎ 摘　　要

NOVELTY - The structure has a foam layer (2) provided with light porous semi-grid flexible material. Thermal conducting medium is injected within multiple closed cells and voids the foam layer. A heat dissipating layer (1) couples the thermal conducting medium that is provided with a planar unsaturated ring, where thermal conductivity of the planar unsaturated ring is determined for about 1.3 W. The foam layer is electrically tuned to function as mechanical equivalent of an electrical notch filter, an electrical lowpass filter or an electrical high pass filter, where the thermal conducting medium is contained with mixture of graphene and silver. USE - Elastic thermal connection structure. ADVANTAGE - The structure reduces power draw and/or clock speed to address poor temperature management, allows an electronic device to maintain a safe operating state or protect multiple devices from moisture by compensating or insulating the electronic device from a cold condition and ensures stable and reliable thermal connection between an electrical component and an external heat dissipation component. DESCRIPTION OF DRAWING(S) - The drawing shows a top perspective view of an elastic thermal connection structure. Heat dissipating layer (1) Foam layer (2)