• 专利标题:   Processing uniform electroplating of inorganic non-metal base material useful in e.g. electronic device, comprises e.g. adding high-conductivity activated plating solution with circulating filtration system, placing substrate on annular cathode fixing frame, and plating.
  • 专利号:   CN114016095-A
  • 发明人:   ZHENG X, JIANG Z, ZHANG L
  • 专利权人:   SHENZHEN TIANXI TECHNOLOGY DEV CO LTD
  • 国际专利分类:   C25D017/10, C25D021/12, C25D003/38
  • 专利详细信息:   CN114016095-A 08 Feb 2022 C25D-003/38 202245 Chinese
  • 申请详细信息:   CN114016095-A CN11560490 17 Dec 2021
  • 优先权号:   CN11560490

▎ 摘  要

NOVELTY - Processing uniform electroplating of inorganic non-metal base material comprises (1) adding high-conductivity activated plating solution to electroplating bath with circulating filtration system, (2) placing the substrate on annular cathode fixing frame, and (3) electrifying anode and cathode, and plating electroplated printed circuit board (PCB) board. USE - The base material is useful in electronic device e.g. electronic watch, calculator, large to computer, communication electronic device and military weapon system. ADVANTAGE - The inorganic non-metal base material uniform electroplating process method: utilizes the high conductivity activated plating solution, which can make the copper ion in the solution dispersed more uniformly, and accelerate the migration rate of the ion, which also can improve the uniformity of the electro-plating, adding water-soluble potassium dihydrogen phosphate (PDP) and graphene activator; overcomes the problem that the single Pd water solubility is bad and it is easy to agglomerate; and utilizes the synergistic effect of Pd and graphene, which greatly improves the catalytic activity and improves the efficiency of electro plating.