▎ 摘　　要

NOVELTY - Conductive adhesive comprises 5-20 pts. wt. epoxy resin, 20-85 pts. wt. conductive agent, 0.1-10 pts. wt. graphene, 1-5 pts. wt. curing agent, 1-5 pts. wt. modified resin and 1-15 pts. wt. other additives. USE - The conductive adhesive is useful for chip packaging. ADVANTAGE - The adhesive utilizes excellent mechanical, heat transfer, electrical properties and physical properties, improves strength of the base material, improve toughness, improves electrical conductivity and avoids affecting the electrical conductivity of the final product. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing the conductive adhesive involving (i) mixing and dispersing the coupling agent with the conductive agent and coating the coupling agent on the surface of the conductive agent to form a conductive filler and (ii) mixing the conductive filler, epoxy resin, curing agent, graphene and other additives, dispersing in a high-speed disperser for 1 minute to 1 hour, vacuum degassing to form a conductive adhesive and a vacuum packaging to obtain the product.