▎ 摘　　要

NOVELTY - Preparing directional heat conducting sheet involves: (S1) preparing fluid composition for heat conducting sheet; (S2) placing the fluid composition in an orientation forming device, applying high-speed shear force in circular motion to the fluid composition layer by layer, orienting a heat conducting filler in the composition in the shear direction to form an oriented thin-layer composition, and collecting the thin-layer composition in a mold layer by layer to form a continuous multilayer component; (S3) thermally curing the component to obtain an orientation composition block; and (S4) slicing the block in a direction perpendicular to the orientation. USE - The method is useful for preparing directional heat conducting sheet used for semiconductor radiating device (all claimed). ADVANTAGE - The method provides directional heat conducting sheet with excellent orientation, few defects, and high efficiency and uniformity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a semiconductor radiating device, which comprises the directional heat conducting sheet clamped between a packaged chip and a radiator.