• 专利标题:   Graphene quantum dot composite plating solution for electroplating copper sheet, comprises graphene quantum dots, nickel sulfate, nickel chloride, boric acid, organic additives and water-soluble nonionic surfactant.
  • 专利号:   CN114318432-A
  • 发明人:   CHEN N, LI Y, LI Z, LEI W
  • 专利权人:   UNIV JIANGSU TECHNOLOGY
  • 国际专利分类:   C25D015/00, C25D003/12, C25D007/06
  • 专利详细信息:   CN114318432-A 12 Apr 2022 C25D-003/12 202244 Chinese
  • 申请详细信息:   CN114318432-A CN10036591 13 Jan 2022
  • 优先权号:   CN10036591

▎ 摘  要

NOVELTY - A graphene quantum dot composite plating solution comprises 1.0-2.0 g/L graphene quantum dots, 250.0-350.0 g/L nickel sulfate, 25.0-35.0 g/L nickel chloride, 30.0-40.0 g/L boric acid, 0.15-0.25 g/L organic additive and 0.1-0.2 g/L TMN surfactant (water-soluble nonionic surfactant). USE - Graphene quantum dot composite plating solution for electroplating copper sheet (claimed). ADVANTAGE - The graphene quantum dot composite plating solution uses graphene quantum dots to improve the disorder degree of the metal crystal plane, increase the nucleation growth point, inhibit the continuous growth of crystals, refine the structure, and improve the surface property of the coating, thereby effectively improving the corrosion resistance, hardness and wear resistance of the composite coating, and provides plating layer with uniform grain size and distribution, uniform surface density and uniform surface roughness. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) preparation of the graphene quantum dot composite plating solution; and (2) electroplating process of the graphene quantum dot composite plating solution, which involves using pretreated copper sheet and the graphene quantum dot composite plating solution.