▎ 摘　　要

NOVELTY - The LED device has a light emitting structure (LS) mounted on sub-mount structure (SM) to include first semiconductor layer (120), second semiconductor layer (140), and active layer (130) between first and second semiconductor layers. The electrode portions have a first electrode portion (252) and a second electrode portion (251) connected to first and second semiconductor layers, respectively. Each of the first and second electrode portions has a first metal layer (221,222), a graphene layer (231,232), and a second metal layer (241,242) sequentially provided on first substrate (200). USE - LED device. ADVANTAGE - Prevents current crowding effect in the LED device and consequently improves light emitting efficiency of the LED device since electric current is uniformly supplied to the whole region of second semiconductor layer due to low resistivity of the graphene layer. The LED device is operated at low temperature and has improved reliability by dissipating heat generated in the LED device to the outside through bottom of LED device. Improves light emitting efficiency of the LED device due to high optical transmittance of the graphene layer. The graphene layer improves electric charge diffusion and heat dissipation. The second metal layer contributes to lower the electric current required to operate the LED device. The graphene layer is used as the electrode of LED device without additional transfer process and/or patterning process since sub-mount structure is formed to have triple-layer structure of metal-graphene-metal that serves as electrode of LED device. Improves light emitting efficiency and heat-dissipating efficiency of the LED devices since graphene layer is provided as a portion of electrode. The electrode of LED device is realized using the damage-free graphene layer since there is no need to perform the transfer process of graphene layer. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of fabricating a light emitting diode. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the LED device. First semiconductor layer (120) Active layer (130) Second semiconductor layer (140) First substrate (200) First metal layer (221,222) Graphene layer (231,232) Second metal layer (241,242) Second electrode portion (251) First electrode portion (252) Light emitting structure (LS) Sub-mount structure (SM)