▎ 摘　　要

NOVELTY - A microelectronic device (101) comprises microelectronic die, and composite (705) material to conduct heat from the microelectronic die. The composite material comprises polymer chain chemically bonded to a fill particles comprising hexagonal lattice of carbon atoms. USE - Microelectronic device used in system (claimed). DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) system (700), which comprises microelectronic die, heat spreader (703) comprising surface (S1) adjacent the microelectronic die and surface (S2) opposite the microelectronic die, and composite material on one of the surface (S1) or surface (S2). The composite material comprises polymer chain chemically bonded to a fill particle comprising hexagonal lattice of carbon atoms; and (2) formation of the microelectronic device assembly, which involves applying a composite material over a microelectronic die, and curing the composite material to chemically bond at least a polymer chain (P1) of polymer chains to at least a fill particles (F1) of the fill particles through functional group (G1) of the fill particles (F1). DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the microelectronic die incorporated into a system. Microelectronic die (101) System (700) Substrate (701) Heat spreader (703) Composite (710)