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  • 专利标题:   Preparing thermally conductive adhesive used in power components involves mixing the matrix resin with the sheet-like thermally conductive filler, acoustic cavitation treatment and negative pressure treatment are carried out to obtain a rubber compound.
  • 专利号:   CN114316868-A
  • 发明人:   WANG B, LIU F, PAN H, XU W
  • 专利权人:   SHANGHAI HUILAN MATERIAL TECHNOLOGY CO
  • 国际专利分类:   C08J003/28, C08L063/00, C09J011/04, C09J163/00
  • 专利详细信息:   CN114316868-A 12 Apr 2022 C09J-163/00 202256 Chinese
  • 申请详细信息:   CN114316868-A CN11653739 30 Dec 2021
  • 优先权号:   CN11653739

▎ 摘　　要

NOVELTY - Preparing thermally conductive adhesive involves mixing the matrix resin with the sheet-like thermally conductive filler, acoustic cavitation treatment and negative pressure treatment are carried out to obtain a rubber compound. The sizing material is mixed with a curing agent to obtain the thermally conductive adhesive. USE - Method for preparing thermally conductive adhesive used in power components (claimed). ADVANTAGE - The heat conducting glue has excellent heat-conducting performance after curing, bonding performance and high and low temperature stability.