• 专利标题:   Diaphragm structure of microelectromechanical system (MEMS) microphone, has first polysilicon layer, graphene layer and second layer that are provided with corrugated structure, and are laminated sequentially.
  • 专利号:   CN219068364-U
  • 发明人:   LI X, WANG Z, MIAO J
  • 专利权人:   HUAJING SENSING TECHNOLOGY WUXI CO LTD
  • 国际专利分类:   H04R019/02, H04R007/14
  • 专利详细信息:   CN219068364-U 23 May 2023 H04R-019/02 202346 Chinese
  • 申请详细信息:   CN219068364-U CN23428230 20 Dec 2022
  • 优先权号:   CN23428230

▎ 摘  要

NOVELTY - The utility model claims a diaphragm structure and MEMS microphone, the diaphragm structure comprises: sequentially first polysilicon layer laminated, at least one layer of graphene layer of a layer and a second polysilicon layer; wherein the first polysilicon layer, the graphene layer and the second polysilicon layer are provided with a corrugated structure, the first polysilicon layer, the corrugated structure sequentially the layer and graphene second polysilicon layer are laminated. The utility model can improve the sensitivity and reliability of the diaphragm structure at the same time. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a MEMS microphone.