• 专利标题:   Method for preparing nanoporous copper composite material, involves preparing nanoporous copper composites by depositing structure containing graphene layer on nanoporous copper layer into impregnation solution and sintering.
  • 专利号:   CN107739869-A
  • 发明人:   KANG J, WANG Y, ZHOU T, QIAO Z, ZHANG Z, YU Z
  • 专利权人:   UNIV TIANJIN POLYTECHNIC
  • 国际专利分类:   C01B032/184, C01B032/186, C22C001/08, C22C009/00
  • 专利详细信息:   CN107739869-A 27 Feb 2018 C22C-001/08 201825 Pages: 11 Chinese
  • 申请详细信息:   CN107739869-A CN11099533 09 Nov 2017
  • 优先权号:   CN11099533

▎ 摘  要

NOVELTY - The method for preparing nanoporous copper composite material, involves preparing nanoporous copper layer by placing copper-manganese alloy sheet in dealloyed etching solution, vacuuming and etching, preparing graphene layer by placing nanoporous copper layer in crucible, adding mixture composed of methane, hydrogen and argon, growing hydrogenated graphite, and preparing nanoporous copper composites by depositing the structure containing graphene layer on the nanoporous copper layer into the impregnation solution and sintering the obtained product. USE - Method for preparing nanoporous copper composite material (claimed). ADVANTAGE - The method enables simple and economical preparation of nanoporous copper composite material with excellent infiltration effect, high interfacial bonding effect, and high stability, and does not produce graphene agglomeration. DETAILED DESCRIPTION - Method for preparing nanoporous copper composite material, involves sequentially placing nanoporous copper layer, graphene layer and nanoporous copper composites. The specific process is carried out by preparing nanoporous copper layer, forming graphene layer on the nanoporous copper layer, and forming nanoporous copper composites on the graphene layer. The nanoporous copper layer is obtained by preparing copper-manganese alloy sheet, configuring dealloyed etching solution with concentration of 0.025-1 mol/L, placing the copper-manganese alloy sheet in dealloyed etching solution, transferring the copper-manganese alloy sheet and dealloyed etching solution to volumetric flask, vacuuming and etching to obtain nanoporous copper layer. The graphene layer is prepared by placing the nanoporous copper layer in crucible, heating at the rate of 1-10 degrees C/minute, adding mixture composed of methane, hydrogen and argon, growing hydrogenated graphite at temperature (I), stop introducing methane and not changing the flow of hydrogen and argon, after the growth of the hydrogenated graphite, continuously heating, insulating for 5-60 minutes at temperature (II), finished heating, cooling the sample in the furnace, depositing graphene layer on the nanoporous copper layer, when the temperature drops to room temperature. The nanoporous copper composite is prepared by formulating the impregnation solution composed of saturated aqueous solution of copper sulfate, a saturated aqueous solution of copper nitrate and saturated solution of alcoholic copper nitrate, depositing the structure containing graphene layer on the nanoporous copper layer into the impregnation solution, ultrasonically processing for 5-60 minutes, placing the immersed structure of the graphene layer deposited on the nanoporous copper layer in a heating furnace, sintering to obtain nanoporous copper composites. The dealloyed etching solution is selected from dilute hydrochloric acid, diluted sulfuric acid, dilute nitric acid or ammonium sulfate. An INDEPENDENT CLAIM is included for nanoporous copper composite material, which comprises nanoporous copper layer, graphene layer and copper layer.