• 专利标题:   Preparing graphene-doped copper bonding wire comprises taking graphene oxide, mixing with mixed metal powder to obtain molten mixed powder, placing semi-finished product wire into aqueous solution of reducing agent for heating, annealing, washing and drying.
  • 专利号:   CN115846453-A
  • 发明人:   FENG Z, QU S, LIU B, WANG T, LIN L
  • 专利权人:   YANTAI YESNO ELECTRONIC MATERIALS CO LTD
  • 国际专利分类:   B21C001/00, B21C037/04, C22C001/10, C22C009/00, C22F001/02, C22F001/08, C23C022/73
  • 专利详细信息:   CN115846453-A 28 Mar 2023 B21C-037/04 202332 Chinese
  • 申请详细信息:   CN115846453-A CN11578171 09 Dec 2022
  • 优先权号:   CN11578171

▎ 摘  要

NOVELTY - Preparing graphene-doped copper bonding wire comprises (i) mixing the simple substances of each component according to ratio of the elements of the copper bonding wire, grinding, and sieving to obtain mixed metal powder, taking graphene oxide, and mixing with the mixed metal powder to obtain molten mixed powder, (ii) preparing the copper alloy ingot of fixed size after melting molten mixed powder, and preparing semi-finished wire with a diameter of 0.1-0.2 mm through rough drawing, middle drawing and fine drawing of the gold alloy ingot, (iii) placing the semi-finished product wire into the aqueous solution of the reducing agent for heating and washing, drying and fine pulling to 0.07-0.15 mm, entering into the aqueous solution of the reducing agent for heating and washing, finally entering into the aqueous solution of the reducing agent, heating and washing, and drying, and (iv) heating filament to 200-350℃ under the protection of nitrogen, annealing, washing and drying. USE - The method is useful for preparing graphene-doped copper bonding wire. ADVANTAGE - The method reduces the micro-crack generated in the filament in the cold-drawing process.