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  • 专利标题:   Dipping glue composition comprises e.g. bisphenol F-type epoxy resin, modified epoxy resin, reactive diluent, silicon micro-powder, calcium carbonate, graphene, silane coupling agent and amine curing agent.
  • 专利号:   CN110819281-A
  • 发明人:   QU X, YANG Z, WU H, HU S, CAO X, ZHANG Y, CHI J, QIN R, GONG X, WANG Y
  • 专利权人:   ZHENGZHOU ZHONGYUAN SILANDE HIGH TECHNOL, ZHENGZHOU SILANDE NEW MATERIAL TECHNOLOG
  • 国际专利分类:   C09J011/04, C09J163/00
  • 专利详细信息:   CN110819281-A 21 Feb 2020 C09J-163/00 202020 Pages: 9 Chinese
  • 申请详细信息:   CN110819281-A CN11164160 25 Nov 2019
  • 优先权号:   CN11164160

▎ 摘　　要

NOVELTY - Dipping glue composition comprises component A and component B in a mass ratio of 2:1-3:1. The component A includes 50-75 pts. wt. bisphenol F-type epoxy resin, 5-15 pts. wt. modified epoxy resin, 5-10 pts. wt. reactive diluent, 10-20 pts. wt. silicon micro-powder, 10-18 pts. wt. calcium carbonate, 0.03-0.2 pts. wt. graphene and 0.5-1 pts. wt. silane coupling agent. The component B includes 60-70 pts. wt. amine curing agent, 10-20 pts. wt. silicon micro-powder and 10-20 pts. wt. calcium carbonate. The modified epoxy resin is (I) having epoxy value of 0.49-0.52. USE - The composition is useful as base coat-free dipping glue (claimed). ADVANTAGE - The composition: has excellent medium resistance; and is cured at low temperatures, and suitable for industrial production. DETAILED DESCRIPTION - Dipping glue composition comprises component A and component B in a mass ratio of 2:1-3:1. The component A includes 50-75 pts. wt. bisphenol F-type epoxy resin, 5-15 pts. wt. modified epoxy resin, 5-10 pts. wt. reactive diluent, 10-20 pts. wt. silicon micro-powder, 10-18 pts. wt. calcium carbonate, 0.03-0.2 pts. wt. graphene and 0.5-1 pts. wt. silane coupling agent. The component B includes 60-70 pts. wt. amine curing agent, 10-20 pts. wt. silicon micro-powder and 10-20 pts. wt. calcium carbonate. The modified epoxy resin is of formula (I) having epoxy value of 0.49-0.52. R = -CH3OH or -CH3CH2OH. An INDEPENDENT CLAIM is also included for preparing composition, comprising (i) mixing reactive diluent, silane coupling agent and graphene to obtain graphene slurry, then mixing modified epoxy resin, silica micro-powder and calcium carbonate under vacuum, then adding bisphenol F- type epoxy resin and graphene slurry material and mixing uniformly to obtain component A, (ii) adding modified fatty amine curing agent, 15-30% silicon micro-powder and calcium carbonate and mixing uniformly under vacuum, then adding remaining amount of amine curing agent and mixing uniformly to obtain component B, and (iii) uniformly mixing the prepared component A and component B by stirring uniformly to obtain final product.