• 专利标题:   Thermally-conductive silicone compound for preparing gel for cryptocurrency mining, comprises silicone resin, metal-carbon composite filler comprising metal e.g. silver and graphene-carbon nanotube composite, spherical alumina and non-spherical alumina, and dispersant which is siloxane resin.
  • 专利号:   WO2021261758-A1, KR2022000327-A, KR2388812-B1
  • 发明人:   KWON J S, SUNG S K, CHA E J, SUNG S, EUN J C
  • 专利权人:   KWON J S
  • 国际专利分类:   C08K003/14, C08K003/04, C08K003/08, C08L083/04
  • 专利详细信息:   WO2021261758-A1 30 Dec 2021 202207 Pages: 19
  • 申请详细信息:   WO2021261758-A1 WOKR005665 06 May 2021
  • 优先权号:   KR078058, KR158059

▎ 摘  要

NOVELTY - A thermally-conductive silicone compound comprises a silicone resin, a metal-carbon composite filler comprising metal(s) chosen from silver, platinum, copper, nickel, molybdenum and aluminum, and graphene-carbon nanotube composite, alumina, and a dispersant which is a siloxane resin. The thermally-conductive silicone compound comprises 1-3 pts. wt. metal-carbon composite filler with respect to 100 pts. wt. of total amount of silicone resin, alumina and dispersant. The alumina comprises spherical alumina (a1) having an average particle diameter of 15-30 mu m, 10-40 wt.% non-spherical alumina (a2) having an average particle diameter of 2-10 mu m, and 0.1-25 wt.% non-spherical alumina (a3) having an average particle diameter of 0.1-0.8 mu m. USE - Thermally-conductive silicone compound is used for preparing gel (claimed) for cryptocurrency mining. ADVANTAGE - The silicone compound has high thermal conductivity by maximizing contact gap by suppressing increase in viscosity when mixing with filler, and improved flowability, adhesiveness and thickness uniformity, and is easy to apply. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) manufacture of the thermally-conductive silicone compound, which involves preparing alumina by mixing alumina (a1), alumina (a2) and alumina (a3), mixing alumina, dispersant, silicone resin and metal-carbon composite filler to obtain a mixture, stirring at 25 degrees C for 10 minutes to 2 hours, heating at 120-180 degrees C for 0.5-2 hours under vacuum, and drying at 25 degrees C for 0.5-2 hours; and (2) thermally-conductive gel, which comprises a gel component in which the thermally-conductive silicone compound is cured.