▎ 摘　　要

NOVELTY - Graphene/metal composite layer structure comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces, and any section in the thickness direction of interpenetrating network contains electroplated metal and graphene, the average thickness ratio of the two is 4-6:5-8, thickness of the interpenetrating network is 0.1-10 μm. USE - The graphene/metal composite layer structure is useful in item in electroplating process, preferably used for flexible circuit board, metallization of non-metallic surface, electromagnetic shielding material or heat dissipation material. ADVANTAGE - The composite layer structure: has high interface bonding strength, and is beneficial to improve the electrical and thermal conductivity of the interface. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparing the graphene/metal composite layer structure comprising (1) pretreating the surface and/or pore structure of the insulating substrate; (2) coating the prepared graphene dispersion on the surface of the pretreated insulating substrate in step (1), and drying to form a conductive layer for metal electroplating; and (3) electroplating the substrate with the conductive layer in step (2) to makes the graphene in the conductive layer and the electroplated metal form an interpenetrating network structure, removing the substrate to obtain the graphene/metal composite layer structure; or, after step (2) drying to form a conductive layer, first removing base material, electroplating conductive layer so that the graphene on both sides of the conductive layer forms an interpenetrating network structure with electroplated metal respectively; the graphene dispersion comprises water, graphene and water-soluble conductive polymer, dispersion state of graphene in the stable graphene dispersion liquid of water-soluble conductive polymer, to maintain the conductivity in the graphene dispersion liquid; substrate includes a surface and pore structure recessed on the surface.