▎ 摘　　要

NOVELTY - A graphene high-temperature pressure sensor packaging method involves taking graphene pressure sensor with a high temperature package overall structure, where the graphene pressure sensor comprises casing, base and substrate, the base and the outer casing are active sealing, the substrate and the base are bonded by gold-gold to form an oxygen-free vacuum chamber, and the gold-gold composite bonding is carried out by carrying out negative gel lithography to form a mask for depositing gold nanoparticles by selecting a photoresist to be relatively easy to remove negative release adhesive, performing gold nanoparticle deposition, forming a patterned gold nanoparticles, allowing the gold surface to plasma pretreatment, followed by performing gold surface self-assembly monolayer pretreatment, bonding gold-gold directly, annealing the gold-gold -bonded sensor to further promote diffusion between gold atoms and improving bonding performance. USE - Method for packaging graphene high-temperature pressure sensor. ADVANTAGE - The method ensures the oxygen-free vacuum environment and increases the temperature of the sensor to 900 degrees C. DETAILED DESCRIPTION - A graphene high-temperature pressure sensor packaging method involves taking graphene pressure sensor with a high temperature package overall structure, where the graphene pressure sensor comprises casing, base and substrate, the base and the outer casing are active sealing, the substrate and the base are bonded by gold-gold to form an oxygen-free vacuum chamber, and the gold-gold composite bonding is carried out by carrying out negative gel lithography to form a mask for depositing gold nanoparticles by selecting a photoresist to be relatively easy to remove negative release adhesive, performing gold nanoparticle deposition, forming a patterned gold nanoparticles by using a wet process to remove glue, obtaining a seal ring and micro-bumps containing gold nanoparticles, allowing the gold surface to plasma pretreatment, followed by performing gold surface self-assembly monolayer pretreatment, bonding gold-gold directly in the bonding environment filled with nitrogen, controlling the temperature below 300 degrees C, adjusting the bonding machine state, level and corner calibration, automatically or manually aligning the chip with the substrate and performing bonding, annealing the gold-gold -bonded sensor to further promote diffusion between gold atoms and improving bonding performance.