▎ 摘　　要

NOVELTY - The application claims a heat sink and laser, belonging to the technical field of photoelectric. the heat sink comprises a substrate, and a diamond layer and a graphene sequentially laminated on the substrate along the direction away from the substrate, the thickness of the film graphene less than the thickness of the diamond layer, the film graphene used for fixing with the light emitting chip. The light emitting chip in the application laser is fixed on the heat sink, which can solve the problem that the light emitting chip is easy to be damage and the use reliability of the laser is low. The application model is used for assisting the radiating of the light emitting chip. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a kind of laser.