▎ 摘　　要

NOVELTY - Preparing substrate comprises forming insulating layer on a substrate, forming polyimide layer on the insulating layer so that adhesion between the substrate and the insulating layer is weaker than the adhesion between the substrate and polyimide layer, the adhesion between the polyimide layer and the insulating layer is stronger than the adhesion between the substrate and the insulating layer, then preparing metal layer, an organic material layer, and an inorganic material layer on the polyimide layer and mechanically peeling the substrate and the polyimide layer and then attaching the insulating layer to polyimide layer. USE - The substrate is useful in display device (claimed). ADVANTAGE - The method: is short and low cost without causing damage to the device.