▎ 摘　　要

NOVELTY - The structure has a crystal seed layer formed with a metal layer (202). The metal layer is provided with multiple metal parts that are separated from each other that are fixed on the first crystal seed layers (201). A radiating layer is fixed on a crystal seeds layer and continuously covers a gap between the metal parts and two adjacent metal parts. The crystal seeds are connected with each other through a hole. The through hole (302) is formed between the crystal seeds. USE - The radiating structure is useful in a packaging structure of an electronic product. ADVANTAGE - The structure accelerates the radiating rate of the packaging structure, so as to solve the stress or warp problem caused by heat accumulation. The radiating layer is set on the seed layer and continuously covers a set of metal parts and the gap between two adjacent metal parts, thus accelerating the heat dissipation rate of a package structure. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a partial package structure with a heat dissipation structure. Heat dissipation structure (200) First crystal seed layers (201) Metal layer (202) Plurality of metal portions (203) First heat dissipation layer (205) Protruding downward (207) Through hole (302) Dielectric layer (304) Bonding pad (306) Then remove layer (308) First metal layer (311)