▎ 摘　　要

NOVELTY - The structure has an interconnect structure (100) comprising an electrically conductive interconnect element (102) that is in a predefined shape (106) i.e. S-shape, and provided with spaced apart end portions (108, 110) extending between first and second planes (112, 114). A winded graphene ribbon (104) i.e. graphene nano-ribbon, is carried around the electrically conductive interconnect element. The winded graphene ribbon provides increased electrical current carrying capability and increased thermal conductivity. The conductive interconnect element is formed of beryllium copper. USE - Structure for implementing enhanced interconnects i.e. graphene interconnects, for high conductivity applications such as high performance computer CPU, I/O and memory sub-systems. ADVANTAGE - The structure has the winded graphene ribbon so as to provide increased electrical current carrying capability and increased thermal conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for implementing enhanced interconnects for high conductivity applications. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of a graphene interconnect structure. Interconnect structure (100) Electrically conductive interconnect element (102) Winded graphene ribbon (104) Predefined shape (106) Spaced apart end portions (108, 110) Planes (112, 114)