• 专利标题:   High thermal conductive composite material comprises copper foil that is used as substrate, and graphene acrylic resin composite material that is bonded to surface of copper foil.
  • 专利号:   CN108753087-A
  • 发明人:   LIAN Z, LI S, ZENG Y, WANG C
  • 专利权人:   XIAMEN HI LIGHT LIGHTING CO LTD, UNIV HUAQIAO, HUBEI YONGCHUANGXIN ELECTRONICS CO LTD
  • 国际专利分类:   C09D133/08, C09D007/61, C09K005/14, B05D007/14, B05D007/24
  • 专利详细信息:   CN108753087-A 06 Nov 2018 C09D-133/08 201906 Pages: 7 Chinese
  • 申请详细信息:   CN108753087-A CN10531764 29 May 2018
  • 优先权号:   CN10531764

▎ 摘  要

NOVELTY - High thermal conductive composite material comprises copper foil that is used as a substrate, and graphene acrylic resin composite material that is bonded to the surface of the copper foil, where the graphene acrylic resin composite material comprises an acrylic resin material and graphene, and is prepared by subjecting graphene and acrylic resin to ball-milling and pre-heat treatment to obtain the product. USE - High thermal conductive composite material used in radiating field. ADVANTAGE - The high thermal conductive composite material has good contact between the layers of graphene sheets, enables to realize the smooth conduction of the graphene heat conduction channel, and realize the integration of the structure and function of the material. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing high thermal conductive composite material, which involves involves subjecting graphene and acrylic resin to ball-milling and pre-heat treatment to obtain a graphene acrylic resin composite material, raising the temperature to a certain temperature, coating the acrylic resin composite material uniformly on the surface of the copper foil, performing continuous rolling until the thickness of the graphene acrylic resin composite material layer is between 2-100 mu m and cooling to obtain high thermal conductive composite material.