• 专利标题:   Positive temperature coefficient device used for thermistor, comprises nanocomposite layer containing polymer resin having preset thermal expansion coefficient and conductive nano-filler, and nanocomposite layer containing rubber resin.
  • 专利号:   KR2023077132-A
  • 发明人:   NAH C, SHIN P, LEE G, KIM S H
  • 专利权人:   UNIV CHONBUK NAT IND COOP FOUND
  • 国际专利分类:   H01C017/02, H01C007/02
  • 专利详细信息:   KR2023077132-A 01 Jun 2023 H01C-007/02 202348 Pages: 11
  • 申请详细信息:   KR2023077132-A KR164067 25 Nov 2021
  • 优先权号:   KR164067

▎ 摘  要

NOVELTY - A positive temperature coefficient device comprises nanocomposite layer (A) containing a polymer resin having a thermal expansion coefficient at 90° C of 200-250 e-6/K and a conductive nano-filler, and a nanocomposite layer (B) containing a rubber resin having a thermal expansion coefficient at 90° C of 90-120 e-6/K and conductive nano-fillers. USE - Positive temperature coefficient device used for thermistor and protection circuit element. ADVANTAGE - The device has excellent flexibility and positive temperature coefficient effect. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of positive temperature coefficient device.