▎ 摘　　要

NOVELTY - Adhesive film (1) is formed of an adhesive resin composition that contains (A) a thermally conductive filler composed of at least one of a graphene having a two-dimensional structure and a single-walled boron nitride, (B) a thermosetting component and (C) a binder polymer, and which is used in a heating process that comprises a preliminary heating step and a complete curing step of completely curing the adhesive film after the preliminary heating step. In the preliminary heating step, the adhesive film is held at a temperature that is not more than the temperature (T) below for 30 minutes or more. USE - The adhesive film is used for an adhesive film with support sheet, and is used for producing a cured product and producing a structure (all claimed). The adhesive film and the cured product are used for cooling the electronic device by interposing it between the heat-generating electronic device and the heat-dissipating substrate or heat sink. The structure is useful as a structure including an electronic device that generates heat and a heat-dissipating substrate or heat sink. ADVANTAGE - The adhesive film exhibits excellent thermal conductivity. The adhesive film, the adhesive film with a support sheet, the cured body and the structure are excellent in thermal conductivity. The adhesive film has improved flexibility and adhesiveness. DETAILED DESCRIPTION - Adhesive film (1) is formed of an adhesive resin composition that contains (A) a thermally conductive filler composed of at least one of a graphene having a two-dimensional structure and a single-walled boron nitride, (B) a thermosetting component and (C) a binder polymer, and which is used in a heating process that comprises a preliminary heating step and a complete curing step of completely curing the adhesive film after the preliminary heating step. In the preliminary heating step, the adhesive film 1 is held at a temperature that is not more than the temperature (T) below for 30 minutes or more, where the temperature (T) is a temperature at which the adhesive film 1 has a 0.5% weight loss if an adhesive film 1 before an arbitrary heating process is subjected to a thermogravimetric measurement where the adhesive film is heated at 40-400 degrees C at a heating rate of 10 degrees C/minute in the ambient atmosphere. The area ratio of the void portion in the cross section in the thickness direction of the cured product obtained by (a) heat-treating the adhesive film under the conditions is 10% or less, where the conditions such as the heat treatment includes a preliminary heating step (a1) and a complete curing step (a2) of completely curing the adhesive film after the preliminary heating step. In the step (a1), a step of holding the adhesive film at a temperature equal to or lower than a temperature at which the weight of the adhesive film is reduced by 0.5% for 30 minutes or more when the thermogravimetric measurement is performed under the condition of raising the temperature of the adhesive film before any heat treatment is 40-400 degrees C at a heating rate of 10 degrees C/min under an ambient atmosphere. INDEPENDENT CLAIMS are included for the following: (1) a method for manufacturing an adhesive film, involving mixing the thermally conductive filler (A) and the binder polymer (C) in a solvent, further mixing the thermosetting component (B) to obtain an adhesive resin composition, and forming the obtained adhesive resin composition into a film; (2) an adhesive film with support sheet, comprising the above-mentioned adhesive film and a support sheet laminated on at least one side of the adhesive film; (3) a cured product obtained by subjecting the above-mentioned adhesive film to a heat treatment, where the area ratio of the void portion in the cross section in the thickness direction is 10% or less; (4) a method for producing a cured product, involving heat-treating the adhesive film to obtain a cured product, where the heat treatment includes step (a1) and step (a2); and (5) a method for producing a structure, involving a bonding step of bonding at least a portion of the first member to at least a portion of the second member through the above-mentioned adhesive film, and after the bonding, heat-treating the adhesive film to form a cured product, and obtaining a structure in which at least a portion of the first member and at least a portion of the second member are bonded through the cured product, where the heat treatment includes steps (a1) and (a2). DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of an adhesive film with a support sheet. Adhesive film (1) Adhesive film with support sheet (2) Support sheet (11) Release sheet (12)