▎ 摘　　要

NOVELTY - The structure has a graphene radiating fin fixed to a contact surface of a chip package body. A graphite heat abstractor is provided with a metal carrier chip i.e. copper foil or aluminum foil that is formed on a graphene thin film. The graphene radiating fin is fixed to the metal carrier chip. A surface of the metal carrier chip is provided with a radiator assembly. The radiator assembly adopts an aluminum radiator or copper radiator graphene. USE - Flexible substrate based three-dimensional packaging heat radiation structure. ADVANTAGE - The structure increases an ultra-high heat conducting performance of a heat abstractor channel that increases heat radiating efficiency. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a flexible substrate based three-dimensional packaging heat radiation structure preparation method. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a flexible substrate based three-dimensional packaging heat radiation structure. '(Drawing includes non-English language text)'