▎ 摘　　要

NOVELTY - The heat sink has heat collection element that collects heat from heat source and dissipates heat through heat dissipation element. The heat sink is formed of nano graphene platelet-reinforced composite having discrete NGPs as reinforcement phase dispersed in matrix material and NGPs occupy specific weight fraction and are only graphitic or carbonaceous filler dispersed in matrix. The matrix material is selected from polymer, metal, ceramic, glass, carbonaceous, graphitic material, thermoplastic, thermoset resin, rubber or elastomer and interpenetrating network polymer. USE - Integrated heat sink used in electronic device and LED system (all claimed). ADVANTAGE - The finned heat sink formed of nano graphene platelet reinforced composite exhibits a thermal conductivity comparable to or greater than the thermal conductivity of the resin-impregnated, and a higher mechanical strength. The thermally and electrically conductive graphene platelet composite is used to produce finned heat sinks cost effectively in large quantities, using commonly used, less complex, and easier-to-control processes with readily available, inexpensive equipment. The integral finned heat sink formed of NGP-reinforced composite exhibits a combination of exceptional thermal conductivity, electrical conductivity, mechanical strength, surface hardness, and scratch resistance. The fins and the base portion of the heat sink are formed into an integral structure that does not involve attaching or bonding individual fin components to the base, or stacking and assembling individual fin sheets together. The highly conductive NGP-reinforced composite heat sink meets the technical requirements. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) electronic device; and (2) method for producing integrated heat sink. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of the heat sink supported by heated block that simulates heat source.