▎ 摘　　要

NOVELTY - The utility model claims a microphone packaging structure, MEMS microphone and electronic device, the microphone packaging structure comprises: substrate; the substrate is formed with a back hole; a back plate, the back plate is installed on the substrate through a spacer; composite diaphragm, the composite diaphragm is installed between the spacer and the substrate, and the composite diaphragm is set corresponding to the back hole, a back cavity is formed between the composite diaphragm and the back plate, the back plate is provided with a through communicate the back cavity, and the composite diaphragm is provided with an exhaust hole of the back cavity and the back hole communicate The composite vibration film comprises a diaphragm main body and a composite layer, the composite layer is deposited on the diaphragm main body of nitrogen-doped reducing graphene oxide. The utility model uses composite vibration film with composite layer, the composite layer is deposited on the diaphragm main body of nitrogen-doped reducing graphene oxide, with conductivity, improving the conductivity of the composite diaphragm, and enhances the strength and bending deformation capability of the composite diaphragm, realizing the improvement of the composite vibration film smoothness, prolonging the service life, The sensitivity of the MEMS microphone is improved. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) an MEMS microphone; (2) an electronic device.