▎ 摘　　要

NOVELTY - Preparation of electronic packaging material involves mixing 2 %mass graphene oxide, 50 %mass silicon carbide particle and remaining aluminum powder, preparing wrap and carrying out physical sintering. The aluminum powder comprises 50% aluminum-40 silicon alloy powder and 50% aluminum alloy powder. The aluminum alloy of LF21 aluminum alloy. USE - Preparation of electronic package material for use in military electronic equipment, portable device and aviation application. ADVANTAGE - The method enables preparation of electronic package material having density less than 3.1 g/cm3, thermal conductivity of more than 180 W/K, and increased comprehensive performance.