▎ 摘　　要

NOVELTY - A thermosetting resin composition contains thermosetting resin and inorganic filler in which inorganic filler is oxidized graphene or graphene coated treatment and graphene oxide or quality of graphene is 0.01-5 wt.% of inorganic filler. USE - A thermosetting resin composition for pre-peg used for laminate and printed circuit board (claimed). ADVANTAGE - Preparation of the copper clad base plate and preparation of copper clad substrate light transmittance is reduced, and product has improved mechanical property. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) processing of thermosetting resin composition which involves dissolving or dispersing in solvent; (2) pre-peg comprising reinforced material attached to dry impregnated thermosetting resin composition; (3) laminate comprising pre-peg; and (4) printed circuit board comprising pre-peg.