▎ 摘　　要

NOVELTY - Soldering paste comprises metal nano particles, graphene oxide, ascorbic acid, dispersant, thickener and thixotropic agent. The mass percentage of metal nanoparticles is 75-85. The mass percentage of graphene oxide is 5-10. The mass percentage of ascorbic acid is 3-8. The mass percentage of dispersant is 2-8. The mass percentage of thickener is 2-8. The mass percentage of thixotropic agent is 2-8. USE - Soldering paste. ADVANTAGE - The metal nanoparticles has anti-oxidation ability and improves overall thermal and electrical conductivity of solder layer. The nano-metals and graphene oxide can effectively fill defects of sintered solder layer, reduces overall porosity of solder layer and further improves overall conductivity, heat dissipation and bonding performance of solder layer.