• 专利标题:   Forming electroplated copper on surface of non-metal materials by graphene-based plating ink involves preparing graphene-based plating ink, spraying plating ink on surface of non-metal material and drying ink sprayed on surface.
  • 专利号:   US2020149178-A1
  • 发明人:   KU K, CHANG K, LAI C
  • 专利权人:   NANJING GRAPHENE RES INST CORP
  • 国际专利分类:   C01B032/194, C09D011/037, C09D011/10, C25D003/38, C25D005/02, C25D005/54
  • 专利详细信息:   US2020149178-A1 14 May 2020 C25D-005/54 202043 Pages: 9 English
  • 申请详细信息:   US2020149178-A1 US189557 13 Nov 2018
  • 优先权号:   US189557

▎ 摘  要

NOVELTY - Forming electroplated copper on surface of non-metal materials by graphene-based plating ink involves preparing a graphene-based plating ink, spraying the graphene-based plating ink on a surface of a non-metal material, drying the graphene-based plating ink sprayed on the surface of the non-metal material at a temperature between 50-200 degrees C for 5-30 minutes, and immersing the non-metal material with the graphene-based plating ink on the surface in a plating solution, and applying a voltage or current to form electroplated copper on the graphene-based plating ink. USE - Method for forming electroplated copper on surface of non-metal materials by graphene-based plating ink. ADVANTAGE - The method enables to form electroplated copper which is eco-friendly, cost-effective and saves time.