▎ 摘　　要

NOVELTY - Preparing high frequency copper clad laminate of PPO resin base material comprises (1) taking end-group epoxidized polyphenylene ether, toluene, dicyandiamide, N,N-dimethylformamide and titanium dioxide-loaded montmorillonite-graphene oxide, and uniformly stirring to obtain PPO resin glue, and (2) taking the glass fiber cloth, soaking in the PPO resin glue, drying at 80-110℃ to obtain the substrate, taking 4-6 substrates to overlap each other, covering the two surfaces with copper layers, and hot-pressing to obtain high frequency copper clad laminate with PPO resin base material. USE - The method is useful for preparing high frequency copper clad laminate of PPO resin base material, which is used in electronic product, including mobile phone, personal digital assistant (PDA), portable multimedia player (PMP), digital camera, digital camcorder, digital video camera (DVC), digital photo frame, portable game machine and portable electronic book (e-book). ADVANTAGE - The high frequency copper-clad laminate has excellent dielectric properties, good heat resistance, and excellent peeling strength, and can be applied to high-frequency environment. The end group epoxidized polyphenylene oxide is connected with epoxy group, improving the thermal stability and solvent resistance of the resin titanium dioxide graphene oxide, montmorillonite is increased, and imparting excellent mechanical property of epoxy resin so that the copper clad plate can be used in high frequency environment. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for high frequency copper clad laminate of PPO resin base material prepared by the above preparation method.