• 专利标题:   Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.
  • 专利号:   WO2022248893-A1, US2022380901-A1
  • 发明人:   ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D
  • 专利权人:   UNIV NAT TECH ATHENS, ZERGIOTI I, UNIV BARILAN, GRAPHENEA SEMICONDUCTOR SLU, GRAPHENEA SEMICONDUCTOR SLU, UNIV BARILAN, UNIV NAT TECH ATHENS, ZERGIOTI I
  • 国际专利分类:   B23K026/00, B41J002/00, B41J002/005, B41M001/26, B41M005/035, B41M007/00, B82Y010/00, B82Y030/00, B82Y040/00, C01B032/184, C23C014/04, C23C014/06, C23C014/12, C23C014/28, C23C014/58, G06F003/00, H01L021/02, H01L023/00, H01L029/16, H01L029/66, H05K003/12, C01B019/00, C01B021/064, C01B032/186, C01B032/194, C01G039/06, C09D011/037, C09D011/52, C23C016/48, C23C016/56, G01D005/24, H01L029/786
  • 专利详细信息:   WO2022248893-A1 01 Dec 2022 C23C-014/04 202201 Pages: 56 English
  • 申请详细信息:   WO2022248893-A1 WOGR000025 27 Apr 2022
  • 优先权号:   US193968P, US725365

▎ 摘  要

NOVELTY - Digital formation of two-dimensional materials structures involves generating a receiver substrate, generating a donor substrates (112, 124) containing a back surface (116) and a front surface (120), applying a coating to the front surface, the coating contains a donor material comprising two-dimensional material, aligning the front surface of the donor substrate to be parallel to and facing the receiver substrate, wherein the donor substrate is arranged adjacent to a target layer on the receiver substrate, and irradiating the coating through the back surface of the donor substrate with one or more laser pulses to transfer only the two-dimensional material to the target layer. USE - Digital formation of two-dimensional materials structures used for electronic components (claimed). ADVANTAGE - The method is solvent-free dry-transfer method which completely removal of polymer stamps or controls the damage caused by the physical delamination of the two-dimensional material when it is peeled off a metal substrate., and provides electronic components with high level of architectural complexity and functionality. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for system, which comprises a laser configured to generate a laser beam, one or more optical elements configured to direct the laser beam through a focusing lens, one or more beam control elements configured to transmit the laser beam through the focusing lens, a translation stage assembly (A1) adapted to support a donor substrate containing a back surface, a front surface and a coating arranged on the front surface, a translation stage assembly (A2) adapted to support a receiver substrate, and a controller communicatively coupled to the translation stage assemblies (A1) and (A2) and the one or more beam control elements and is configured to direct the translation stage assembly (A2) to align the receiver substrate to a focal plane of an objective lens, direct at least one of the translation stage (A1) or (A2) to align the front surface of the donor substrate to be parallel to and facing the receiver substrate, the coating on the donor substrate is located at the focal plane of the objective lens, and direct at least one of translation stage (A1), the translation stage (A2), or the one or more beam control elements to irradiate the coating through the back surface of the donor substrate to transfer only the two-dimensional material to a target layer on the receiver substrate; and #electronic component, which comprises a substrate, and an electronic device arranged upon the substrate comprising a two-dimensional material which is deposited upon the substrate via laser induced forward transfer by generating a receiver substrate, generating a donor substrate, applying a coating to the front surface, aligning the front surface of the donor substrate to be parallel to and facing the receiver substrate, the donor material is arranged adjacent to a target layer on the receiver substrate associated with the electronic device, and irradiating the coating through the back surface of the donor substrate with one or more laser pulses produced by a laser to transfer only the two-dimensional material to the target layer. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a laser transfer assembly for the system. 104Laser transfer assembly 108Transfer beam 112,124Donor substrate 116Back surface 120Front surface 128Transfer material portion