• 专利标题:   Electrically conductive device used in semiconductor devices as conductive interconnects comprises graphene layer on substrate, protein tube portion on graphene layer, and conductor penetrating through protein tube potion to graphene layer.
  • 专利号:   US2013168861-A1, CN103187391-A, US8932950-B2, CN103187391-B
  • 发明人:   WANG X, ZHANG H
  • 专利权人:   SEMICONDUCTOR MFG INT BEIJING CORP, SEMICONDUCTOR MFG INT SHANGHAI CORP, SEMICONDUCTOR MFG INT BEIJING CORP
  • 国际专利分类:   H01L021/768, H01L023/482, H01L023/522, H01L021/44
  • 专利详细信息:   US2013168861-A1 04 Jul 2013 H01L-023/482 201348 Pages: 14 English
  • 申请详细信息:   US2013168861-A1 US664317 30 Oct 2012
  • 优先权号:   CN10459310

▎ 摘  要

NOVELTY - An electrically conductive device comprises a graphene layer (213) on a substrate (215), a protein tube portion (208) on graphene layer, and a conductor (210) penetrating through the protein tube potion to the graphene layer, where the conductor is in electrical contact with the graphene layer. USE - As electrically conductive device used in semiconductor devices as conductive interconnects. ADVANTAGE - The graphene layer is protected from being damaged because the protein tube portion and the conductor penetrating through the protein tube portion are formed on the graphene layer with the conductor in electrical contact with the graphene layer, and no etching is employed during the formation of the protein tube portion and the conductor. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacturing an electrically conductive device involving forming a protein tube portion, forming a conductor penetrating through the protein tube portion, transferring a graphene layer onto the protein tube portion such that the graphene layer is in electrical contact with the conductor, and transferring the protein tube portion, the conductor and the graphene layer onto a target substrate, such that the graphene layer is in electrical contact with an exposed conductive element on the target substrate. DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of process for manufacturing a device having an interconnecting conductive structure. Composite unit (21) Dummy dielectric material layer (204) Protein tube portion (208) Conductor (210) Graphene layer (213)