▎ 摘　　要

NOVELTY - Method for manufacturing flexible electronic device involves (i) permeating flexible substrate, soaking in a 50% silver nitrate solution at a temperature of 40-50 degrees C for 1-1.5 hours, (ii) performing semi-immersion on the flexible substrate in silver nitrate solution, (iii) taking out the flexible substrate and leaving still at room temperature for 10-15 minutes, (iv) allowing the flexible substrate to form original area and permeable area, allowing the original area and the permeable area to form a whole through a semi-permeable area, arranging a component to be installed in the semi-permeable area, and providing a modified film at the component to be installed. USE - The method is useful for manufacturing a flexible electronic device. ADVANTAGE - The method increases the toughness and durability of the flexible substrate while maintaining the flexibility of the flexible substrate.