▎ 摘　　要

NOVELTY - Graphene-modified printed circuit board (PCB) clad plate comprises polytetrafluoroethylene (PTFE)-based prepreg, copper foil and layer of chemical vapor deposited graphene is provided between the PTFE-based prepreg and copper foil. USE - Used as graphene-modified printed circuit board (PCB) clad plate. ADVANTAGE - The plate has improved thermal, electrical and mechanical properties. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing graphene-modified printed circuit board (PCB) clad plate, comprising (i) preparing epoxy resin glass fiber prepreg; (ii) placing a PTFE-based prepreg in a cavity of a chemical vapor deposition apparatus and performing graphene growth where allowing graphene to grow on one or both sides; (iii) placing grown graphene PTFE-based prepreg on one side, the surface of the PTFE-based prepreg with graphene grown is facing outward, and the surface of the graphene-free surface is opposite, and adding 1-5 sheets of PTFE-based prepreg in the middle according to the thickness of the copper-clad laminate; (iv) placing copper foil on the upper and lower sides of the structure, adding it into the hot press furnace for hot pressing at 1x 10-3 mbar, heating rapidly to 150 degrees C for 30-50 minutes, warming up to 300-350 degrees C for 90-100 minutes, preserving for 90-120 minutes and dividing pressurization into two steps, where pressure applied during the heating process is 4-5 MPa, and heat preservation process is 4.5-5.5 MPa; and (v) cooling to room temperature, and releasing pressure, where pressure releasing speed is less than 0.1 MPa/second. DESCRIPTION OF DRAWING(S) - The diagram shows a schematic representation of graphene-modified printed circuit board (PCB) clad plate.