• 专利标题:   Layered composite material used as heat conducting material comprises graphene layer and metal copper layer.
  • 专利号:   CN114250492-A
  • 发明人:   HU W, DENG Y, QIN Z, CHEN J, WU Z
  • 专利权人:   UNIV TIANJIN
  • 国际专利分类:   B82Y030/00, B82Y040/00, C09K005/14, C25D003/38, C25D005/10, C25D005/18, C25D009/04
  • 专利详细信息:   CN114250492-A 29 Mar 2022 C25D-003/38 202240 Chinese
  • 申请详细信息:   CN114250492-A CN11026749 25 Sep 2020
  • 优先权号:   CN11026749

▎ 摘  要

NOVELTY - A layered composite material comprises graphene layer and metal copper layer compounded on the upper surface and lower surface of graphene layer. The thickness of each of the metal copper layer is micron level. The thickness of the graphene layer is nano scale. USE - The layered composite material is used as heat conducting material (claimed). ADVANTAGE - The material has high thermal conductivity in the horizontal direction of reduced graphene oxide. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of the layered composite material comprises dispersing graphene oxide in water to obtain graphene oxide solution; dispersing brightener, sulfuric acid and copper sulfate in water uniformly to obtain copper plating solution; taking copper sulfate plating solution as the electrolyte, adding to two-electrode system with direct current pulse power supply, reducing divalent copper ions to copper particles and depositing on the cathode plate for 10-60 minutes at current density of 1-10 A/dm2 to obtain metal copper layer, taking metal copper layer as working electrode and graphene oxide dispersion as electrolyte, and electrodepositing graphene layer on metal copper layer using potentiostatic pulse method for 40-3600 seconds to obtain metal copper/reduced graphene oxide two-layer structure; and taking metal copper/reduced graphene oxide two-layer structure as cathode and copper sulfate plating solution as electrolyte, and electrodepositing metal copper layer using two-electrode system with direct current pulse power supply at current density of1-10A/dm2 to reduce copper ions into copper particles for 10-60 minutes.