▎ 摘　　要

NOVELTY - Antistatic conductive adhesive comprises 50-85 pts. wt. nano-silver/functionalized graphene hybrid conductive filler, 10-40 pts. wt. siloxane resin, 0.1-0.8 pts. wt. catalyst, 0.1-0.8 pts. wt. reinforcing agent, 0.1-0.5 pts. wt. inhibitor and 0.1-0.5 pts. wt. crosslinking agent. The nano-silver/functionalized graphene hybrid conductive filler is obtained by preparing perylene diimide oxynitride as a surfactant to non-covalently functionalize graphene nanosheets, and then hybridize with silver acetate. USE - Antistatic conductive adhesive for circuit board. ADVANTAGE - The non-covalent combination strengthens the connection between graphene and metal silver particles, so it can enhance the conductivity. The addition of graphene can improve the mechanical properties of the conductive adhesive, and the performance tends to be more stable in the face of temperature changes. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing antistatic conductive adhesive, which involves taking by weighing siloxane resin, nano-silver/functionalized graphene hybrid conductive filler, stirring and dispersing uniformly, stirring for 0.5 to 1h, grinding for 1 to 3 times, continuously adding catalyst, reinforcing agent, inhibitor, crosslinking agent, stirring uniformly, vacuumizing and degassing to obtain the antistatic conductive adhesive.