▎ 摘　　要

NOVELTY - A resin composition comprises a polymer substrate comprising a curing agent comprising a phenol resin and an epoxy resin and (meth)acrylate-based resin comprising a (meth)acrylate-based repeating unit comprising an epoxy-based functional group and a (meth)acrylate-based repeating unit (BzMA) comprising an aromatic functional group, and a magnetic filler comprising a core and a coating layer for coating the surface of the core and dispersed in the polymer substrate. The coating layer comprises one or more of yttrium oxide, magnesium oxide, aluminum oxide, silicon oxide, and ferrite. USE - Resin composition used for forming adhesive film for forming dicing die-bonding film for bonding for semiconductors (all claimed). ADVANTAGE - The resin composition has excellent volume resistance, and effectively reduces electromagnetic interference. The dicing die-bonding film minimizes noise caused by electromagnetic interference occurring between semiconductor packages, and solves an interference problem caused by electromagnetic noise between chips. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) adhesive film for semiconductors, which comprises the resin composition; and (2) dicing die-bonding film, which comprises a base film, an adhesive layer (L1) formed on the base film, and an adhesive layer (L1) comprising the adhesive film formed on the adhesive layer (L1).