▎ 摘　　要

NOVELTY - The method involves establishing a physical model of the wave-absorbing material with the combined structure based on the impedance matching theory. The square resistance value of the wave absorbing layer is calculated. The geometrical structure of the wave-absorbing material is modeled by using CST software. The wave-absorbing characteristic simulation parameters are obtained. A graphene is prepared by using a chemical vapor deposition CVD method. A super-surface wave-absorbing material sample is prepared by using a laser etching technology. The wave-absorbing characteristic and the isolation is tested between chips. USE - Graphene absorbing ultra-surface decoupling design method applied to the electromagnetic compatibility (EMC) design of communication equipment and coupling path of equipment used in home and abroad. ADVANTAGE - The graphene absorbing ultra-surface decoupling design method is provided by absorbing space electromagnetic interference signal, improving chip isolation degree. The method is based on impedance matching characteristics researching different conductivity graphene film electromagnetic loss characteristics improving electromagnetic wave absorptivity, using cross-shaped and four-concave combined structure, using the ultra simulation software surface unit optimization design, realizing double-frequency resonance. The ultra-thin medium layer with stable chemical property is prepared by the ceramic. The high-efficient obtain of the wave-absorbing material to the third chip space electromagnetic wave, reducing the electromagnetic interference of the first chip and the second chip, and improves chip isolation. DESCRIPTION OF DRAWING(S) - The drawing shows a flow diagram for graphene absorption ultra-surface decouplinng design method. (Drawing includes non-English language text)