▎ 摘　　要

NOVELTY - A wafer cleaning device comprises a brush head for brushing the surface to be cleaned of the wafer. A base for bearing the brush head and provided with the conductive disc(s). The magnetic field generating structure emits a magnetic field perpendicular to the disk direction of the conductive disk. The disk surface is parallel to the surface. The base is capable of rotating around the axis. The conductive plate is embedded in the inner unit of the base. The material of the brush washing unit is graphene oxide or mixed copolymer of carbon nano-tube and polyvinyl alcohol. USE - Wafer cleaning device for cleaning back surface of wafer used in manufacturing process of semiconductor device. Can also be used in cleaning surface of metal ions, organic matter, etc. ADVANTAGE - The device avoids particulate matter so as to improve yield of a wafer product in process of cleaning a back of the wafer. The device allows a controller connected with the base and the magnetic field generating structure for adjusting rotating speed of the base, the rotating direction of a rotating unit, the direction of magnetic field, and the intensity of the electric field, so that the conductive disk generates an induced electric field in the process of rotating the substrate, thus cleaning the surface to be cleaned of the substrate in an effective manner. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a wafer cleaning method. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the device.