• 专利标题:   Anti-fake and information encryption system based on super-surface thermal radiation modulator, has pixel unit that is spatially arranged in pixel space according to image information., where pixel unit is provided with pixel structure.
  • 专利号:   CN115000716-A
  • 发明人:   ZENG F, TIAN X, LI Y, XU K, MAO B, REN M, SU J, WANG P, DING P
  • 专利权人:   UNIV ZHENGZHOU AERONAUTICS
  • 国际专利分类:   H01Q001/38, H01Q015/00, H01Q021/00
  • 专利详细信息:   CN115000716-A 02 Sep 2022 H01Q-015/00 202284 Chinese
  • 申请详细信息:   CN115000716-A CN10784023 28 Jun 2022
  • 优先权号:   CN10784023

▎ 摘  要

NOVELTY - The encryption system has a metal substrate layer (1), a dielectric layer (2), a graphene layer (3), and a metal nano-antenna (4). The metal nano-antenna layer is composed of metal nano-antenna array according to the size and arrangement period of the metal nano-antenna in the metal nano-antenna array is different. Two pixel structures are obtained. The pixel structure is formed into a pixel unit. The pixel unit is spatially arranged in the pixel space according to image information. The pixel unit comprises a pixel structure. The different pixel structures form different pixel units are represented by different colors. The electric excitation and infrared band selection of the control unit are under the set condition. The information of the pixel space arrangement carried by the thermal image map is displayed. USE - Anti-fake and information encryption system based on super-surface thermal radiation modulator for use in information encryption platform. ADVANTAGE - The encryption system realizes the hiding of the information, so as to improve the flexibility and security of the anti-fake and information encryption. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an anti-fake and information encryption method based on super-surface thermal radiation modulator. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the anti-fake and information encryption system based on super-surface thermal radiation modulator. 1Metal substrate layer 2Dielectric layer 3Graphene layer 4Metal nano-antenna 5External circuit