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  • 专利标题:   Heat dissipating material used for light-emitting diode lamp includes silicone modified phenolic resin, magnesium oxide, silicon micropowder, kaolin, boron nitride, lime powder, manganese sulfide, graphene, metal powder and antioxidant.
  • 专利号:   CN108148345-A
  • 发明人:   HE J
  • 专利权人:   HE J
  • 国际专利分类:   C08L061/14, C08K013/02, C08K003/22, C08K003/36, C08K003/34, C08K003/38, C08K003/30, C08K003/04, C08K003/08
  • 专利详细信息:   CN108148345-A 12 Jun 2018 C08L-061/14 201846 Pages: 4 Chinese
  • 申请详细信息:   CN108148345-A CN11098213 03 Dec 2016
  • 优先权号:   CN11098213

▎ 摘　　要

NOVELTY - Heat dissipating material comprises 46-56 pts. wt. silicone modified phenolic resin, 1.5-3.5 pts. wt. magnesium oxide, 11-13 pts. wt. silicon micropowder, 10-16 pts. wt. kaolin, 8-12 pts. wt. boron nitride, 5-7 pts. wt. lime powder, 1.6-2.2 pts. wt. manganese sulfide, 6-8 pts. wt. graphene, 5-7 pts. wt. metal powder, 10-16 pts. wt. potassium sulfate and 5-7 pts. wt. antioxidant. USE - Heat dissipating material used for light-emitting diode lamp (claimed). ADVANTAGE - The material prolongs service time of lamp and has good lighting effect.