▎ 摘　　要

NOVELTY - The method involves providing a substrate and a chip is arranged on the substrate, and the chip and the substrate are electrically connected. The insulating glue is set, and the insulating glue is sprayed on the periphery of the chip. An installation height of the insulating glue is ensured on the substrate that is higher than the distance between the chip and the substrate. A heat dissipation layer is provided, and a graphene heat dissipation layer is provided on the surface of the substrate on which the upper core is provided with the insulating glue. USE - Method for packaging semiconductor for semiconductor product and electronic product (all claimed). ADVANTAGE - The excellent heat dissipation performance of graphene improves the heat dissipation effect of semiconductor products by setting insulating glue. The height of the insulating glue is set to be higher than the distance between the chip and the substrate, which effectively prevents the graphene heat dissipation layer from extending to the chip and the substrate to cause a short circuit. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a semiconductor product; and (2) an electronic product. DESCRIPTION OF DRAWING(S) - The drawing shows a flowchart illustrating a method for packaging semiconductor. (Drawing includes non-English language text)