▎ 摘　　要

NOVELTY - Adhesive film comprises a thermally conductive filler (A) having a two-dimensional crystal structure, an epoxy component (B), a curing agent (C), and a binder polymer (D), where at least one of the component (B) and the component (C) has a pi -conjugated mesogen skeleton, preferably the component (B) has the pi -conjugated mesogen skeleton. USE - The adhesive film is used in an adhesive film with a support sheet and for forming a structure and used for cooling electronic device and structure equipped with a heat-generating electronic device and a heat-radiating substrate or heat sink. ADVANTAGE - The adhesive film exhibits exceptional thermal conductivity, stability, electrical and optical characteristics as well as excellent shear adhesive strength and highly adhesive and reliable. The adhesive film maintains excellent mechanical strength and adhesiveness of the film forming property and excellent tackiness. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a method for producing the adhesive film involving mixing the component (A) and the component (D) in a solvent, obtaining an adhesive resin composition by mixing the component (B) and the component (C) and forming the obtained adhesive resin composition into a film shape to obtain the product; (2) an adhesive film with a support sheet comprising the adhesive film and a support sheet laminated on at least one surface side of the adhesive film; (3) a structure in which at least a part of a first member and at least a part of a second member are joined via a cured body of the adhesive film; (4) a adhesive resin composition and the curing agent (C), and forming the obtained adhesive resin composition in the form of a film, After mixing the thermally conductive filler (A) having a two-dimensional crystal structure and the binder polymer (D) in a solvent, an epoxy component (B) in which at least one component has a pi -conjugated mesogen skeleton; (5) a structure in which at least a part of the first member and at least a part of the second member are joined via a cured body of the adhesive film; and (6) a method of manufacturing a structure formed by joining via a cured body involving attaching at least a part of the first member to at least a part of the second member via the adhesive film, and heat-treating the adhesive film to form a hardened body, where at least a part of the first member and at least a part of the second member are bonded via a cured body.