• 专利标题:   Photo-resist welding ink useful for light-emitting diode display printed circuit board boards, comprises oligomer, photoinitiator, nano black filler, flatting agent, coupling agent and solvent, epoxy resin and functional monomer.
  • 专利号:   CN112852215-A, WO2022151781-A1
  • 发明人:   LI X, XU X, XIA J, GAN Z, WU L
  • 专利权人:   HUIZHOU ABSEN PHOTOELECTRIC CO LTD, HUIZHOU ABSEN OPTOELECTRONIC CO LTD
  • 国际专利分类:   C09D011/03, C09D011/101, G03F007/004, G03F007/027, G09F009/33
  • 专利详细信息:   CN112852215-A 28 May 2021 C09D-011/101 202153 Pages: 14 Chinese
  • 申请详细信息:   CN112852215-A CN10038045 12 Jan 2021
  • 优先权号:   CN10038045

▎ 摘  要

NOVELTY - Photo-resist welding ink comprises a first component and a second component. The first component comprises 20-50% oligomer, 0.5-15% photoinitiator, 5-15% nano black filler, 10-30% flatting agent, 0.2-2% coupling agent and 10-30% solvent. The second component comprises 20-40% epoxy resin, 5-40% functional monomer, 10-20% flatting agent, 0.2-2% coupling agent and 5-15% solvent. The first component and the second component are stored separately, and mixed when used to form photo-resist welding ink. USE - The ink is useful for LED display PCB boards. ADVANTAGE - The ink has visible light absorption rate of greater than or equal to 90% and viscosity of 160-220 Pax s at 25 degrees C. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) method for preparing an light-emitting diode (LED) display module, comprising coating or printing the photo-resist welding ink on the first surface of the PCB board, pre-baking, exposure treatment, development treatment, and post-baking, forming photo-resist welding ink layer and mounting a multiple of LED lamp beads on the area not covered by the photo-resist welding ink layer on the first surface; and (2) LED display screen, comprising a multiple of LED display modules, each LED display module includes a printed circuit board (PCB) board and a multiple of LED lamp beads arranged on the PCB board, the surface of the PCB board with the LED lamp beads is provided with a flatting solder resist ink layer formed by curing the matting solder resist ink, and the flatting solder resist ink layer covers the gaps between the multiple of LED lamp beads.