▎ 摘　　要

NOVELTY - Photo-resist welding ink comprises a first component and a second component. The first component comprises 20-50% oligomer, 0.5-15% photoinitiator, 5-15% nano black filler, 10-30% flatting agent, 0.2-2% coupling agent and 10-30% solvent. The second component comprises 20-40% epoxy resin, 5-40% functional monomer, 10-20% flatting agent, 0.2-2% coupling agent and 5-15% solvent. The first component and the second component are stored separately, and mixed when used to form photo-resist welding ink. USE - The ink is useful for LED display PCB boards. ADVANTAGE - The ink has visible light absorption rate of greater than or equal to 90% and viscosity of 160-220 Pax s at 25 degrees C. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) method for preparing an light-emitting diode (LED) display module, comprising coating or printing the photo-resist welding ink on the first surface of the PCB board, pre-baking, exposure treatment, development treatment, and post-baking, forming photo-resist welding ink layer and mounting a multiple of LED lamp beads on the area not covered by the photo-resist welding ink layer on the first surface; and (2) LED display screen, comprising a multiple of LED display modules, each LED display module includes a printed circuit board (PCB) board and a multiple of LED lamp beads arranged on the PCB board, the surface of the PCB board with the LED lamp beads is provided with a flatting solder resist ink layer formed by curing the matting solder resist ink, and the flatting solder resist ink layer covers the gaps between the multiple of LED lamp beads.