• 专利标题:   Electronic element radiating heat installation structure, has base plate fixed with electronic element, and graphene full bonding layer formed on side of heat abstractor, where end of base plate is connected with shell.
  • 专利号:   CN204680660-U
  • 发明人:   LIU Z, ZHU H
  • 专利权人:   LIU Z, ZHU H
  • 国际专利分类:   H01L023/36, H05K007/20
  • 专利详细信息:   CN204680660-U 30 Sep 2015 H01L-023/36 201576 Pages: 5 Chinese
  • 申请详细信息:   CN204680660-U CN20458813 29 Jun 2015
  • 优先权号:   CN20458813

▎ 摘  要

NOVELTY - This utility model claims an electronic component heat abstractor installation structure, mounted with the heat abstractor comprises base plate and electronic element, wherein, one side of graphene full bonding layer between heat abstractor on base plate and electronic element shell, the graphite adhesive layer thickness control at 10 m3/kg degrees centigrade, preparing the graphene layer comprises adhesive with nano level graphite particle. One electronic component heat abstractor installed structure of this utility new model supply and there is no conduction heat retardant heat abstractor on base plate and electronic element, the radiating effect is very hot extrude.