• 专利标题:   Copper thermal radiation material used during manufacturing of e.g. electronic component, has graphene layer that is provided on copper foil or copper alloy foil with thickness of specific range.
  • 专利号:   JP2016207723-A
  • 发明人:   ONO T, KAMMURI K
  • 专利权人:   NIPPON MINING METALS CO LTD
  • 国际专利分类:   C22C009/00, C22C009/02, C22C009/04, C22C009/05, C22C009/06, C22C009/10, H01L023/373
  • 专利详细信息:   JP2016207723-A 08 Dec 2016 H01L-023/373 201701 Pages: 16 Japanese
  • 申请详细信息:   JP2016207723-A JP084477 16 Apr 2015
  • 优先权号:   JP084477

▎ 摘  要

NOVELTY - The copper thermal radiation material has graphene layer that is provided on a copper foil or a copper alloy foil with thickness of 2 nm or more. The surface roughness (Sa) is 0.2 micrometer or less, and the wavelength of the laser beam measured by the laser microscope is 405 nm. The tensile strength is 150 Mpa or more. The surface treatment layer is provided with azoles between copper foil or copper alloy foil, and graphene layer, silane-coupling process layer and surface treatment layers. USE - Copper thermal radiation material used during manufacturing of electronic component, electronic device, liquid crystal panel or display (all claimed). ADVANTAGE - The heat dissipation property of the copper thermal radiation material is improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacturing method of copper thermal radiation material. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional schematic view of the sample. (Drawing includes non-English language text)