▎ 摘　　要

NOVELTY - Low-temperature sintering conductive adhesive modified based on hybrid fillers, comprises 1-50% resin,0.01-30% diluent, 0.1-20% curing agent, 0.01-10% sintering auxiliary materials, and 5-95% modified conductive filler; the modified conductive filler is obtained by modifying the conductive filler with a surface modifier; the conductive filler includes conductive metal, oxide and other inorganic fillers of mass ratio 5:1-2:1; the conductive metal includes nano-silver particles, nano-copper particles, and nano nickel-coated copper nanowires of mass ratio 2:1:1; the oxide includes zirconia, silica, and/or zinc oxide; the other inorganic filler includes carbon nanotube/graphene/cellulose nanofiber composite materials oriented in the resin matrix. USE - The low temperature sintering conductive adhesive is useful in the technical field of semiconductors. ADVANTAGE - The conductive adhesive can be cured and sintered at low temperature, and has excellent conductive thermal conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing low temperature sintering conductive adhesive modified based on hybrid filler, comprising (i) dispersing carbon nanotubes and graphene in deionized water, adding polyvinylpyrrolidone, heating to react, filtering, drying to obtain modified graphene and carbon nanotubes, dispersing the modified graphene and carbon nanotubes in deionized water to obtain dispersion liquid, adding cellulose nanofibers while stirring, continuing stirring and dispersing, transferring the obtained mixed liquid to a mold, placing the mold in liquid nitrogen for freezing, and freeze-drying to obtain carbon nanotube/graphene/cellulose nanofiber composite material, (ii) adding copper chloride dihydrate, hexadecylamine and glucose into water, stirring until the solid dissolves, continuously stirring overnight, transferring obtained solution to high pressure kettle for heating reaction, filtering the reaction solution, washing the solid using mixed solution of water and cyclohexane, drying to obtain copper nanowires, dispersing the copper nanowire in deionized water, adding nickel sulfate and hydrazine, adjusting pH of the solution using ammonia water to 8- 10, performing water bath reaction, filtering the reaction liquid, washing the precipitate, and drying to obtain the nano nickel coated copper nanowire, (iii) dispersing nano silver particles, nano copper particles, nano nickel-coated copper nanowires, oxides, carbon nanotubes/graphene/cellulose nanofiber composites in absolute ethanol, adding silane coupling agent, stirring and refluxing the reaction, filtering, and drying the solid to obtain modified conductive filler, and (iv) mixing resin and curing agent uniformly, adding the modified conductive filler, adding diluent and sintering auxiliary materials, stirring and mixing evenly to obtain conductive adhesive.