▎ 摘　　要

NOVELTY - Preparing enhanced thermal conductive phase change nanocapsule composite material, comprises (1) preparing inorganic shell phase change nanocapsules by interfacial hydrolysis-polycondensation method, (2) adding the inorganic shell phase change nanocapsules, polydimethylsiloxane prepolymer and curing agent into a container for one-time stirring by a mixer, and adding high thermal conductivity filler and co-solvent with same quality of polydimethylsiloxane prepolymer, stirring for second time to obtain rubber compound, and (3) coating the rubber compound in a mold, placing it in a vacuum defoaming barrel and performing defoaming treatment and taking it out, allowing to stand for curing, molding and de-molding to obtain final product. USE - The enhanced thermal conductive phase change nanocapsule composite material is useful as thermal interface material (claimed). ADVANTAGE - The enhanced thermal conductive phase change nanocapsule composite material: has high thermal conductivity and heat storage capacity; utilizes inorganic shell phase-change nanocapsules to reduce the hardness of the polydimethylsiloxane-based composite material, which is more conducive to the bonding interface; is expected to fill the air gap; alleviates the thermal shock of the chip under high heat flux density; and ensures the chip and electronic devices to dissipate heat better. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for enhanced thermal conductive phase change nanocapsule composite material prepared by above method.